TESTING & INSPECTION
We provide strict and professional testing services for electronic components. Each product goes through multiple inspection processes to ensure high performance, reliability and long-term stability for global customers.
X-RAY INSPECTION
Advanced X-ray non-destructive testing equipment to detect internal structure, welding condition, packaging defects and hidden damages. It can accurately identify refurbished, fake or damaged chips without destroying the appearance, ensuring each component is 100% genuine and qualified.
MICROSCOPE VISUAL INSPECTION
High-power electron microscope for full appearance inspection, including surface printing, pin condition, date code, batch number and packaging integrity. Any tiny scratch, deformation or poor processing will be found and rejected, ensuring perfect appearance of every component.
IC DECAPSULATION
Professional IC decapsulation technology to open the chip packaging and check the internal die, circuit structure and manufacturing batch. This process effectively eliminates counterfeit chips, refurbished products and second-hand components, ensuring all chips are original and brand new.
ELECTRICAL PERFORMANCE TEST
Comprehensive electrical parameter test including voltage, current, power, frequency and function verification. All chips are tested under real working conditions to ensure they meet original factory standards, with stable performance and high reliability for industrial and commercial use.
RELIABILITY STRESS TEST
High and low temperature cycling, humidity resistance and vibration tests are performed to simulate extreme working environments. This verifies the long-term stability and durability of components, ensuring they can work reliably in harsh industrial conditions.
ROHS COMPLIANCE TEST
Environmental protection testing to ensure components comply with RoHS standards for lead, mercury, cadmium and other harmful substances. We provide full test reports, supporting customers’ green supply chain requirements for global market access.